1977 Founded as a contract
galvanising business
1984 Rebuilde as printed circuit board
production plant
1993 Relocation to a new production
facility
(plant 2)
1995 Introduction of CAM
1996 Start of multilayer production
1999 Expansion of the production area (plant 3)
2000
Mechanical microvias
2002 Laser microvias,
SBU, HDI
2003 Flexible and rigid-flex production
2004 Development
of multilayer HDI process
2005 Expansion of HF production
2006
Establishment of MOS-compund (China)
2007 Introduction
of Envision process
2008
Introduction of LDI
2009 Establishment of 2 mil technology
(50µm
line / space)
2010 Expansion of thick copper
technology
2012 Enlargement production of flexible and
rigid-flex
printed circuit boards
2013 New production
facility built: 2,500 m2 (plant 1)
2015 New cleanroom technology for etching resist
process
2016 Full
automation of etching resist process
2017 Full automation
of soldermask processand switch
to LDI process
2017 Enlargement of drilling capacity
2018 Renewal of stock for finished goods and base
material
2019 Renewal laboratory and water recycling
2020 Introduction of a new ERP-Software
2020 Renewal of
plating process |
Plant 2
Plant 3
Plant 1
First production plant |
