Visual - Plant 3 new production plant

Die Philosophie

Die MOS Electronic

Historie

Umwelt

Referenzen

Anfahrt


Historie


1977 Founded as a contract galvanising business
1984 Rebuilde as printed circuit board production plant
1993 Relocation to a new production facility (plant 2)
1995 Introduction of CAM
1996 Start of multilayer production
1999 Expansion of the production area (plant 3)
2000 Mechanical microvias
2002 Laser microvias, SBU, HDI
2003 Flexible and rigid-flex production
2004 Development of multilayer HDI process
2005 Expansion of HF production
2006 Establishment of MOS-compund (China)
2007 Introduction of Envision process
2008 Introduction of LDI
2009 Establishment of 2 mil technology (50µm
          line / space)
2010 Expansion of thick copper technology
2012 Enlargement production of flexible and rigid-flex
          printed circuit boards 
2013 New production facility built: 2,500 m2 (plant 1) 
2015 New cleanroom technology for etching resist
          process
2016 Full automation of etching resist process
2017 Full automation of soldermask processand switch
          to LDI process
2017 Enlargement of drilling capacity
2018 Renewal of stock for finished goods and base
          material
2019 Renewal laboratory and water recycling
2020 Introduction of a new ERP-Software
2020 Renewal of plating process
Werk 1
 Plant 2

Werk 2
Plant 3

Werk 3 - Fertigungsneubau
Plant 1


Erstes Produktionsgebäude
First production plant



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